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Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

Bibliographic Details
Corporate Authors: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
Other Authors: Engel, Peter A., Chen, William T.
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, [1993]
Series:EEP (Series) ; vol. 4.
Subjects:
Electronic packaging > Congresses.

Remote Storage

Holdings details from Remote Storage
Call Number: TK7870.15 .A83 1993
Library Owns: TK7870.15 .A83 1993 (v.1-v.2)
Call Number Status Get It
TK7870.15 .A83 1993 v.1 Available
TK7870.15 .A83 1993 v.2 Available