Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition San Francisco, Calif., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Materials Division
Other Authors:	Wu, Tien Y.
Format:	Conference Proceeding Book
Language:	English
Published:	New York : American Society of Mechanical Engineers, [1995]
Series:	EEP (Series) ; v. 11. MD (Series) ; v. 64.
Subjects:	Electronic packaging > Congresses. Fracture mechanics > Congresses.

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