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Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition San Francisco, Calif., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors: Suhling, J. C. (Jeffrey C.)
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [1995]
Series:EEP (Series) ; vol. 13.
AMD (Series) ; vol. 214.
Subjects:
Electronic packaging > Congresses.
Mechanics, Applied > Congresses.
Description
Physical Description:v, 117 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791817393