Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition San Francisco, Calif., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors:	Suhling, J. C. (Jeffrey C.)
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1995]
Series:	EEP (Series) ; vol. 13. AMD (Series) ; vol. 214.
Subjects:	Electronic packaging > Congresses. Mechanics, Applied > Congresses.

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