Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Winter Annual Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Nguyen, Luu T., Pecht, Michael
Format:	Book
Language:	English
Published:	New York : American Society of Mechanical Engineers, [1993]
Series:	EEP (Series) ; vol. 6.
Subjects:	Electronic packaging > Reliability > Congresses.

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