Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition San Francisco, Calif., American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Amon, Cristina H.
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1995]
Series:	HTD (Series) ; vol. 319. EEP (Series) ; vol. 15.
Subjects:	Electronic systems > Cooling > Congresses. Electronic systems > Congresses. Electronic apparatus and appliances > Cooling > Congresses. Electronic apparatus and appliances > Thermal properties > Congresses.

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