Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors:	Chen, William T., Schen, Michael A., Dunn, M. L. (Martin L.)
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1994]
Series:	AMD (Series) ; vol. 187. AMD (Series) ; vol. 193. AMD (Series) ; vol. 195.
Subjects:	Electronic packaging > Congresses.

Table of Contents:

v. 1. Design and process issues in electronic packaging / edited by William T. Chen, Luu T. Nguyen, Walter L. Winterbottom
v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir
v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.