Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors:	Chen, William T., Schen, Michael A., Dunn, M. L. (Martin L.)
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1994]
Series:	AMD (Series) ; vol. 187. AMD (Series) ; vol. 193. AMD (Series) ; vol. 195.
Subjects:	Electronic packaging > Congresses.

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