Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
| Corporate Authors: | , |
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| Other Authors: | , , |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York, N.Y. :
American Society of Mechanical Engineers,
[1994]
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| Series: | AMD (Series) ;
vol. 187. AMD (Series) ; vol. 193. AMD (Series) ; vol. 195. |
| Subjects: |
| Physical Description: | 3 volumes : illustrations ; 28 cm. |
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| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0791814491 (v. 1) 0791814270 (v. 2) 0791814424 (v. 3) |