APA (7th ed.) Citation

International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Applied Mechanics Division, Chen, W. T., Schen, M. A., & Dunn, M. L. (1994). Mechanics and materials for electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. American Society of Mechanical Engineers.

Chicago Style (17th ed.) Citation

International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Applied Mechanics Division, William T. Chen, Michael A. Schen, and M. L. Dunn. Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. New York, N.Y.: American Society of Mechanical Engineers, 1994.

MLA (9th ed.) Citation

International Mechanical Engineering Congress and Exposition, et al. Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. American Society of Mechanical Engineers, 1994.