Cover Image

Quality conformance and qualification of microelectronic packages and interconnects /

Bibliographic Details
Other Authors: Pecht, Michael
Format: Book
Language:English
Published: New York : Wiley, [1994]
Subjects:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.
Description
Item Description:"A Wiley-Interscience publication."
Physical Description:xxxiii, 461 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references (pages 419-450) and index.
ISBN:0471594369 (alk. paper) :