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Quality conformance and qualification of microelectronic packages and interconnects /

Bibliographic Details
Other Authors: Pecht, Michael
Format: Book
Language:English
Published: New York : Wiley, [1994]
Subjects:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.

Remote Storage

Holdings details from Remote Storage
Call Number: TK7870.15 .Q35 1994
 
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TK7870.15 .Q35 1994 Available