Cover Image

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability /

Bibliographic Details
Other Authors: Pecht, Michael
Format: Book
Language:English
Published: New York : Wiley, [1994]
Subjects:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.
Electronic equipment > Packaging
Description
Item Description:"A Wiley-Interscience publication."
Physical Description:xxxi, 426 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0471594466 (cloth : alk. paper)