Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability /

Bibliographic Details
Other Authors:	Pecht, Michael
Format:	Book
Language:	English
Published:	New York : Wiley, [1994]
Subjects:	Electronic packaging > Design. Hybrid integrated circuits > Design and construction. Multichip modules (Microelectronics) > Design and construction. Electronic equipment > Packaging

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