I-THERM IV /

Bibliographic Details
Corporate Authors:	InterSociety Conference on Thermal Phenomena in Electronic Systems Washington, D.C., American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment, Components, Packaging & Manufacturing Technology Society
Format:	Conference Proceeding Book
Language:	English
Published:	[New York] : Institute of Electrical and Electronics Engineers, [1994]
Subjects:	Electronic apparatus and appliances > Thermal properties > Congresses. Concurrent engineering > Congresses.

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