Multilayer ceramic substrate-technology for VLSI package/multichip module /

Bibliographic Details
Main Author:	Ōtsuka, Kanji
Format:	Book
Language:	English
Published:	London ; New York : Elsevier Applied Science, [1993]
Edition:	English language ed.
Series:	Ceramic research and development in Japan.
Subjects:	Electronic ceramics. Electronic packaging > Materials. Integrated circuits > Very large scale integration > Design and construction. Aluminum oxide.

Description
Item Description:	Translation of: Seramikku tasō haisen kiban.
Physical Description:	xiii, 242 pages : illustrations ; 25 cm.
Bibliography:	Includes bibliographical references (pages 223-231) and index.
ISBN:	185166579X