Multilayer ceramic substrate-technology for VLSI package/multichip module /

Bibliographic Details
Main Author:	Ōtsuka, Kanji
Format:	Book
Language:	English
Published:	London ; New York : Elsevier Applied Science, [1993]
Edition:	English language ed.
Series:	Ceramic research and development in Japan.
Subjects:	Electronic ceramics. Electronic packaging > Materials. Integrated circuits > Very large scale integration > Design and construction. Aluminum oxide.

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