Materials in microelectronic and optoelectronic packaging /

Bibliographic Details
Corporate Authors:	International Symposium on Materials for Optoelectronic and Microelectronic Packaging, International Ceramic Science and Technology Congress
Other Authors:	Ling, Hung C., Niwa, Kōichi, Shukla, Vishwa N.
Format:	Conference Proceeding Book
Language:	English
Published:	Westerville, Ohio : American Ceramic Society, [1993]
Series:	Ceramic transactions. v. 33.
Subjects:	Microelectronic packaging > Materials. Optoelectronic devices > Materials.

Description
Item Description:	"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--Title page verso.
Physical Description:	viii, 471 pages : illustrations ; 24 cm.
Bibliography:	Includes bibliographical references and index.
ISBN:	0944904637
ISSN:	1042-1122 ;