Materials in microelectronic and optoelectronic packaging /

Bibliographic Details
Corporate Authors:	International Symposium on Materials for Optoelectronic and Microelectronic Packaging, International Ceramic Science and Technology Congress
Other Authors:	Ling, Hung C., Niwa, Kōichi, Shukla, Vishwa N.
Format:	Conference Proceeding Book
Language:	English
Published:	Westerville, Ohio : American Ceramic Society, [1993]
Series:	Ceramic transactions. v. 33.
Subjects:	Microelectronic packaging > Materials. Optoelectronic devices > Materials.

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