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Characterization of integrated circuit packaging materials /

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Bibliographic Details
Other Authors: Moore, Thomas M., McKenna, Robert G.
Format: Book
Language:English
Published: Boston : Butterworth-Heinemann, [1993]
Series:Materials characterization series.
Subjects:
Electronic packaging > Materials.
Integrated circuits > Design and construction.

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Call Number: TK7870.15 .C52 1993
 
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TK7870.15 .C52 1993 Available