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Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Winter Annual Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Production Engineering Division
Other Authors: Lee, Y. C., Bennett, T. J. (Timothy J.)
Format: Book
Language:English
Published: New York : ASME, [1992]
Series:EEP (Series) ; vol. 2.
PED (Series) ; vol. 60.
Subjects:
Electronic packaging > Congresses.

Remote Storage

Holdings details from Remote Storage
Call Number: TK7870.15 .M34 1992
 
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TK7870.15 .M34 1992 Available