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Stress-induced phenomena in metallization : first international workshop, Ithaca, NY, 1991 /

Bibliographic Details
Corporate Author: International Workshop on Stress-Induced Phenomena in Metallization Ithaca, N.Y.
Other Authors: Li, Che-Yu, Totta, Paul, Ho, P. S.
Format: Conference Proceeding Book
Language:English
Published: New York : American Institute of Physics, ©1992.
Series:American Vacuum Society series ; 13.
AIP conference proceedings ; no. 263.
Subjects:
Semiconductors > Defects > Congresses.
Integrated circuits > Very large scale integration > Defects > Congresses.
Metallic films > Defects > Congresses.
Thin film devices > Defects > Congresses.
Aluminum films > Defects > Congresses.
Metallizing > Congresses.
Strains and stresses > Congresses.
Métallisation > Congrès.
Couches minces métalliques > Fracture > Congrès.
Contraintes (Mécanique) > Congrès.
Métaux > Fracture > Congrès.
Semi-conducteurs > Défauts > Congrès.
Circuits intégrés à très grande échelle > Défauts > Congrès.
Couches minces métalliques > Défauts > Congrès.
Dispositifs à couches minces > Défauts > Congrès.
Couches minces d'aluminium > Défauts > Congrès.
Strains and stresses.
Integrated circuits > Very large scale integration > Defects.
Metallizing.
Semiconductors > Defects.
Thin film devices > Defects.
Elektrische Spannung
Metallisieren
Kongress
Elektrische Spannung.
Kongress.
Metallisieren.
Aluminum films > Congresses
Metallic films > Congresses
Metallizing > Congresses
Semiconductors > Defects > Congresses
Thin film devices > Defects > Congresses
Kongreß > Ithaca (NY) > 1991.
Conference papers and proceedings.
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Call Number: TK7872.C68 S77 1992
 
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TK7872.C68 S77 1992 Available