Computer aided design in electronic packaging /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Winter Annual Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Agonafer, D., Fulton, Robert E.
Format:	Book
Language:	English
Published:	New York : American Society of Mechanical Engineers, 1992.
Series:	EEP (Series) ; vol. 3.
Subjects:	Electronic packaging > Design > Data processing > Congresses. Computer-aided design > Congresses. Conception assistée par ordinateur > Congrès. Computer-aided design Electronic packaging > Design > Data processing CAD. Elektrotechnische industrie. Computer-aided > Congresses Electronic > Design > Data > Congresses Conference papers and proceedings

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