Cover Image

Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /

Bibliographic Details
Corporate Authors: Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division
Other Authors: Singh, Prabjit
Format: Conference Proceeding Book
Language:English
Published: Materials Park, Ohio : ASM International, [1991]
Subjects:
Microelectronic packaging > Materials > Testing > Congresses.
Description
Physical Description:xi, 403 pages : illustrations ; 29 cm.
Bibliography:Includes bibliographical references.
ISBN:0871704358