Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /

Bibliographic Details
Corporate Authors:	Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division
Other Authors:	Singh, Prabjit
Format:	Conference Proceeding Book
Language:	English
Published:	Materials Park, Ohio : ASM International, [1991]
Subjects:	Microelectronic packaging > Materials > Testing > Congresses.

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