APA (7th ed.) Citation

American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Winter Annual Meeting, Chen, W. T., Engel, P. A., & Jahsman, W. E. (1991). Manufacturing processes and materials challenges in microelectronic packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. ASME.

Chicago Style (17th ed.) Citation

American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Winter Annual Meeting, W. T. Chen, Peter A. Engel, and W. E. Jahsman. Manufacturing Processes and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. New York, N.Y.: ASME, 1991.

MLA (9th ed.) Citation

American Society of Mechanical Engineers. Applied Mechanics Division, et al. Manufacturing Processes and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. ASME, 1991.