Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Winter Annual Meeting
Other Authors:	Chen, W. T., Engel, Peter A., Jahsman, W. E. (William E.)
Format:	Book
Language:	English
Published:	New York, N.Y. : ASME, [1991]
Series:	AMD (Series) ; v. 131. EEP (Series) ; v. 1.
Subjects:	Microelectronic packaging > Congresses.

Remote Storage