Cover Image

Proceedings /

Bibliographic Details
New Title:International Conference on Innovative Systems in Silicon. Proceedings
Corporate Authors: International Conference on Wafer Scale Integration, IEEE Computer Society, IEEE Components, Hybrids, and Manufacturing Technology Society, Components, Packaging & Manufacturing Technology Society
Format: Conference Proceeding
Language:English
Published: Washington, D.C. : IEEE Computer Society Press, ©1989-©1995.
Subjects:
Integrated circuits > Wafer-scale integration > Congresses.
Online Availability: Check for online availability
Description
Published:Jan. 3-5, 1989-7th (1995).
Item Description:Published: Los Alamitos, Calif., 1992; New York, N.Y., 1993-1995.
Physical Description:7 volumes : illustrations ; 23 cm.
Publication Frequency:Annual
ISSN:1063-2204