Proceedings /

Bibliographic Details
New Title:	International Conference on Innovative Systems in Silicon. Proceedings
Corporate Authors:	International Conference on Wafer Scale Integration, IEEE Computer Society, IEEE Components, Hybrids, and Manufacturing Technology Society, Components, Packaging & Manufacturing Technology Society
Format:	Conference Proceeding
Language:	English
Published:	Washington, D.C. : IEEE Computer Society Press, ©1989-©1995.
Subjects:	Integrated circuits > Wafer-scale integration > Congresses.
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