Thermal modeling and design of electronic systems and devices : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Dallas, Texas, November 25-30, 1990 /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Winter Annual Meeting, American Society of Mechanical Engineers. Heat Transfer Division
Other Authors:	Wirtz, R. A., Lehmann, G. L.
Format:	Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1990]
Series:	HTD (Series) ; vol. 153.
Subjects:	Electronic apparatus and appliances > Cooling > Mathematical models > Congresses. Heat > Transmission > Mathematical models > Congresses.

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