Ceramic substrates and packages for electronic applications /

Bibliographic Details
Corporate Authors:	International Symposium on Ceramic Substrates and Packages Denver, Colo., American Ceramic Society. Electronics Division, Yōgyō Kyōkai (Japan)
Other Authors:	Yan, Man F.
Format:	Conference Proceeding Book
Language:	English
Published:	Westerville, Ohio : American Ceramic Society, [1989]
Series:	Advances in ceramics ; v. 26.
Subjects:	Electronic ceramics > Congresses. Electronic packaging > Congresses.

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