Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989 /

Bibliographic Details
Corporate Authors:	ASM International Electronic Materials and Processing Congress Philadelphia, Pa., ASM International. Electronic Materials and Processing Division
Other Authors:	Shieh, Wei T.
Format:	Conference Proceeding Book
Language:	English
Published:	Metals Park, Ohio : ASM International, [1989]
Subjects:	Microelectronic packaging > Congresses. Microelectronics > Materials > Congresses. Surface mount technology > Congresses.

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