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Materials and process characterization for VLSI, 1988 (ICMPC '88) : proceedings of the international conference : Oct. 24-29, 1988, Shanghai, China /

Bibliographic Details
Corporate Author: International Conference on Materials and Process Characterization for VLSI
Other Authors: Zong, X.-F. (Xiangfu), Wang, Y.-Y. (Yangyuan), Chen, J. (Jun)
Format: Conference Proceeding Book
Language:English
Published: Singapore ; Teaneck, N.J. : World Scientific, [1988]
Subjects:
Integrated circuits > Very large scale integration > Congresses.

Remote Storage

Holdings details from Remote Storage
Call Number: TK7874 .M34 1988
 
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TK7874 .M34 1988 Available