Adhesives for the composite wood panel industry /

Bibliographic Details
Main Author:	Koch, G. S.
Other Authors:	Klareich, F., Exstrum, B.
Format:	Book
Language:	English
Published:	Park Ridge, N.J., U.S.A. : Noyes Data Corp., 1987.
Subjects:	Adhesives. Wood > Bonding.

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