Cover Image

Electronic packaging and corrosion in microelectronics : proceedings of ASM's third conference on electronic packaging: materials and processes & corrosion in microelectronics, Minneapolis, Minnesota, 28-30 April 1987 /

Bibliographic Details
Corporate Authors: Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics Minneapolis, Minnesota, ASM International. Electronic Materials and Processing Division, University of Minnesota. Corrosion Research Center
Other Authors: Nicholson, Morris E.
Format: Conference Proceeding Book
Language:English
Published: [Metals Park, Ohio] : ASM International, [1987]
Subjects:
Microelectronics > Congresses.
Electronic apparatus and appliances > Design and construction > Congresses.
Electronic apparatus and appliances > Corrosion > Congresses.

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