Electronic packaging and corrosion in microelectronics : proceedings of ASM's third conference on electronic packaging: materials and processes & corrosion in microelectronics, Minneapolis, Minnesota, 28-30 April 1987 /

Bibliographic Details
Corporate Authors:	Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics Minneapolis, Minnesota, ASM International. Electronic Materials and Processing Division, University of Minnesota. Corrosion Research Center
Other Authors:	Nicholson, Morris E.
Format:	Conference Proceeding Book
Language:	English
Published:	[Metals Park, Ohio] : ASM International, [1987]
Subjects:	Microelectronics > Congresses. Electronic apparatus and appliances > Design and construction > Congresses. Electronic apparatus and appliances > Corrosion > Congresses.

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