APA (7th ed.) Citation

Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics Minneapolis, Minnesota, ASM International. Electronic Materials and Processing Division, University of Minnesota. Corrosion Research Center, & Nicholson, M. E. (1987). Electronic packaging and corrosion in microelectronics: Proceedings of ASM's third conference on electronic packaging: materials and processes & corrosion in microelectronics, Minneapolis, Minnesota, 28-30 April 1987. ASM International.

Chicago Style (17th ed.) Citation

Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics Minneapolis, Minnesota, ASM International. Electronic Materials and Processing Division, University of Minnesota. Corrosion Research Center, and Morris E. Nicholson. Electronic Packaging and Corrosion in Microelectronics: Proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987. [Metals Park, Ohio]: ASM International, 1987.

MLA (9th ed.) Citation

Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics Minneapolis, Minnesota, et al. Electronic Packaging and Corrosion in Microelectronics: Proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987. ASM International, 1987.

Warning: These citations may not always be 100% accurate.