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Materials for Electronics Security and Assurance /

Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation.The book discusses recent advances in materials synthesis and characterization techniques for security applications.

Bibliographic Details
Main Author: Asadizanjani, Navid
Corporate Author: ScienceDirect (Online service)
Other Authors: Xi, Chengjie, Tehranipoor, Mark M.
Format: eBook
Language:English
Published: Amsterdam : Elsevier, 2024.
Subjects:
Electronics > Materials.
Électronique > Matériaux.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Front Cover
  • Materials for Electronics Security and Assurance
  • Copyright
  • Contents
  • About the authors
  • Preface
  • Acknowledgment
  • 1 Material for heterogeneous integration: Challenges and opportunities
  • 1.1 Introduction
  • 1.2 Background
  • 1.2.1 The evolution of semiconductor packaging
  • 1.2.2 Homogeneous integration
  • 1.2.3 Heterogeneous Integration (HI)
  • 1.2.3.1 2.5D packaging
  • 1.2.3.2 3D packaging
  • 1.2.3.3 Interconnection
  • 1.3 Security threats in heterogeneous integration circuits
  • 1.3.1 Threat models
  • 1.3.2 Potential hardware attacks
  • 1.3.2.1 Hardware Trojans
  • 1.3.3 Counterfeit ICs
  • 1.3.4 Material-based hardware attacks
  • 1.4 Post-packaging assurance: Nondestructive physical inspection for HI
  • 1.4.1 Structural characterization
  • 1.4.2 Material characterization
  • 1.5 Postpackaging assurance: Destructive physical inspection for HI
  • 1.6 Prepackaging assurance: MEMS & NEMS
  • 1.7 Discussion & conclusion
  • References
  • 2 Packaging encapsulant material for hardware assurance
  • 2.1 Introduction
  • 2.2 Background of IC encapsulant
  • 2.2.1 Encapsulant material composition
  • 2.2.2 Encapsulant fabrication process
  • 2.2.3 Packaging material verification process
  • 2.3 Threat models
  • 2.3.1 Security related chemical and mechanical properties of encapsulant
  • 2.3.2 Existing packaging encapsulant characterization for reliability verification
  • 2.3.2.1 Characterization of thermal and mechanical properties
  • 2.3.2.2 Chemical characterization
  • 2.3.2.3 Volumetric characterization
  • 2.4 Encapsulant material characterization for hardware assurance
  • 2.4.1 Requirements specification
  • 2.4.2 Encapsulate material characterization case study
  • 2.4.2.1 IR-based material characterization
  • 2.4.2.2 X-ray for encapsulant characterization
  • 2.4.2.3 THz-TDS for encapsulant characterization
  • 2.4.3 Other physical inspection methods for encapsulant material characterization
  • 2.5 Summary and discussion
  • References
  • 3 Packaging encapsulant material characterization for counterfeit IC detection
  • 3.1 Introduction
  • 3.2 Background: Material for counterfeit detection
  • 3.2.1 Material-based counterfeit detection methods
  • 3.2.2 Infrared spectroscopy for counterfeit IC detection
  • 3.2.3 NIR for counterfeit IC detection
  • 3.2.4 MIR for counterfeit IC detection
  • 3.3 Chemometrics
  • 3.3.1 Encapsulant material data preprocessing
  • 3.3.2 Dimensional reduction and feature selection
  • 3.3.3 Supervised classification model
  • 3.4 Experiment material and methods
  • 3.4.1 Test samples and data collection
  • 3.4.2 Experimental methods
  • 3.4.3 "Global" counterfeit IC detection results
  • 3.4.4 "Individual" counterfeit IC detection results
  • 3.5 Conclusion and future work
  • References
  • 4 THz for semiconductor assurance
  • 4.1 Introduction
  • 4.2 THz physical inspection
  • 4.2.1 THz system description
  • 4.2.2 Hardware system setup
  • 4.3 THz signal and detector hardware