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Handbook of materials failure analysis : with case studies from the electronic and textile industries /

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Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes.The book begins with a general overview of materials failure analysis a...

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Bibliographic Details
Corporate Author: ScienceDirect (Online service)
Other Authors: Makhlouf, Abdel Salam Hamdy, Aliofkhazraei, Mahmood
Format: eBook
Language:English
Published: Kidlington, Oxford, United Kingdom : Butterworth-Heinemann, 2020.
Subjects:
Fracture mechanics > Handbooks, manuals, etc.
Mécanique de la rupture > Guides, manuels, etc.
Fracture mechanics
Electronic books.
Handbook
handbooks.
Handbooks and manuals
Handbooks and manuals.
Guides et manuels.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Front Cover
  • Handbook of Materials Failure Analysis
  • Copyright Page
  • Contents
  • List of contributors
  • About the editors
  • Preface
  • 1 Electronics industries
  • 1 Failures of electronic devices: solder joints failure modes, causes and detection methods
  • 1.1 Introduction
  • 1.2 Thermal cycling
  • 1.3 Shock and vibration
  • 1.4 Failure detection methods in electronics industry
  • 1.5 Conclusion
  • 1.6 Recommendations
  • References
  • 2 Electron beam radiation and its impacts to failure analysis in semiconductor industry
  • 2.1 Introduction
  • 2.2 Impact of electron beam radiation damage during SEM failure analysis
  • 2.2.1 SEM physical FA and low-k/ultralow-k dielectrics
  • 2.2.2 Electron beam radiation damage to low-k and ultralow-k dielectric materials
  • 2.2.2.1 Electron beam-induced knock-on damage
  • 2.2.2.2 Electron beam-induced thermal damage
  • 2.2.2.3 Electron beam-induced radiolysis damage
  • 2.2.3 Control of electron beam radiation damage to low-k and ultralow-k dielectric materials
  • 2.2.3.1 The effects of acceleration voltage
  • 2.2.3.2 The effects of probe current
  • 2.2.3.3 The effects of Pt anticharging coat layer
  • 2.3 Impact of electron beam radiation during FIB and TEM failure analysis: radiation damage to LK and ULK dielectrics
  • 2.3.1 Electron beam radiation damage during electron beam survey before focus ion beam milling
  • 2.3.2 Electron beam radiation damage during electron beam coating before focus ion beam milling
  • 2.3.3 Electron beam radiation damage during focus ion beam milling for transmission electron microscopy sample preparation
  • 2.3.4 Electron beam radiation damage during transmission electron microscope analysis
  • 2.4 Impact of electron beam radiation damage during TEM failure analysis: radiation damage to silicon nitride.
  • 2.5 Impact of electron beam radiation damage during TEM FA: boron diffusion and segregation induced phase and microstructur...
  • 2.5.1 Stage-I: The electron radiation-induced unilateral amorphization of Co3Fe thin film
  • 2.5.2 Stage-II: The electron radiation-induced recrystallization in the amorphized Co3Fe thin film
  • 2.6 Conclusion
  • References
  • 3 Failure of intermetallic solder ball due to stress shielding and amplification effects
  • 3.1 Introduction
  • 3.2 Methodology
  • 3.2.1 Finite element modeling
  • 3.2.1.1 Finite element modeling based on Brown &amp
  • Srawley analytical model
  • 3.2.1.2 Finite element solder joint modeling
  • 3.2.1.3 Multiple cracks analysis on solder joint behavior-parallel edge cracks
  • 3.2.1.4 Multiple cracks analysis on solder joint behavior-coplanar cracks
  • 3.3 Results and discussion
  • 3.3.1 The effect of distance (B) between two parallel edge cracks
  • 3.3.2 Multiple crack analysis-coplanar cracks
  • 3.3.2.1 The effect of horizontal (x) distance between the coplanar crack tips
  • 3.3.2.2 The effect of horizontal (y) distance between the coplanar crack tips
  • 3.4 Conclusion
  • Acknowledgment
  • References
  • Further reading
  • 4 Assessment of failure of consumer electronics due to indoor corrosion in subtropical climates
  • 4.1 Introduction
  • 4.2 Methods
  • 4.3 Damage analysis
  • 4.4 Discussion
  • 4.5 Conclusion
  • Acknowledgments
  • References
  • 5 Pb-free solder-microstructural, material reliability, and failure relationships
  • 5.1 Introduction
  • 5.1.1 Development of Pb-free solder alloys
  • 5.1.2 Failure and microstructure
  • 5.1.3 An overview of the chapter
  • 5.2 Case study I-Pb-doped solder alloys
  • 5.2.1 Forward compatible mixing
  • 5.2.2 Backward compatible mixing
  • 5.2.2.1 Full mix and partial mix
  • 5.2.2.2 Effect of accelerated temperature cycling profile
  • 5.2.2.3 Effect of Ag content.
  • 5.2.3 Lessons learnt from case study I
  • 5.3 Case study II-First- and second-generation Sn-Ag-Cu solder alloys
  • 5.3.1 Effect of ball grid array component
  • 5.3.2 Effect of Ag content
  • 5.3.3 Effect of dwell time
  • 5.3.4 Effect of accelerated temperature cycling profile
  • 5.3.5 Microstructural evolution and failure mechanisms
  • 5.3.6 Lessons learnt from case study II
  • 5.4 Case study III-High-performance solders (third generation)
  • 5.4.1 Effect of micro-alloying on Sn-Ag-Cu
  • 5.4.2 Two commercialized alloys
  • 5.4.3 Lessons learnt from case study III
  • 5.5 Case study IV-Low-temperature solders
  • 5.5.1 Effect of substrate
  • 5.5.2 Effect of micro-alloying
  • 5.5.3 Lessons learnt from case study IV
  • 5.6 Conclusion
  • References
  • 6 The role of contamination in the failure of electronics-case studies
  • 6.1 Introduction
  • 6.2 Case studies
  • 6.2.1 Example 1-Contamination as a primary cause of motor failures
  • 6.2.1.1 Introduction
  • 6.2.1.2 Motor operation investigation
  • 6.2.1.3 Electrical characterization
  • 6.2.1.4 Control stock motor
  • 6.2.1.5 Failed motor
  • 6.2.1.6 Chemical characterizations
  • 6.2.2 Example 2-Electrolyte contamination
  • 6.2.2.1 A leaking capacitor
  • 6.2.2.2 Other types of electrolyte contamination damage
  • 6.3 Discussion
  • References
  • 7 Analytical solutions for electronic assemblies subjected to shock and vibration loadings
  • 7.1 Introduction
  • 7.2 Test assembly details
  • 7.3 Experimental modal analysis
  • 7.4 Finite element modeling
  • 7.5 Analytical solution details
  • 7.5.1 Free vibration
  • 7.5.2 Forced vibration: harmonic loading
  • 7.5.3 Forced vibration: shock loading
  • 7.6 Results and discussions
  • 7.6.1 Free vibration: natural frequencies and mode shapes
  • 7.6.2 Forced vibration: harmonic loading
  • 7.6.2.1 Corner solder joint deflection validation.
  • 7.6.2.2 Critical solder joint stress analysis
  • 7.6.2.2.1 Printed circuit board stiffness: thickness and modulus of elasticity
  • 7.6.2.2.2 Solder joint geometry: standoff height and diameter
  • 7.6.3 Forced vibration: impact loading
  • 7.6.3.1 Corner solder joint deflection
  • 7.6.3.2 Critical solder joint stress analysis
  • 7.6.3.2.1 Printed circuit board stiffness: thickness and modulus of elasticity
  • 7.6.3.2.2 Solder joint geometry: standoff height and diameter
  • 7.6.3.3 Solder stress response spectrum
  • 7.7 Conclusion
  • Nomenclature
  • References
  • 8 Stress analysis of stretchable conductive polymer for electronics circuit application
  • 8.1 Introduction
  • 8.2 Experimental procedure
  • 8.2.1 Sample preparation
  • 8.2.2 Printing process of circuits
  • 8.2.3 Universal tensile testing
  • 8.3 Stress-strain analysis of substrate and conductive ink
  • 8.3.1 Neo-Hookean model
  • 8.3.2 Multilinear plastic model
  • 8.4 Finite element analysis
  • 8.4.1 Modeling and meshing of different printing shapes models
  • 8.4.2 Boundary conditions
  • 8.4.2.1 Printing circuits
  • 8.4.2.2 Thermal sensor circuit
  • 8.4.3 Analysis using the simulation process
  • 8.5 Results and discussion
  • 8.5.1 Material properties of stretchable electronic circuit material
  • 8.5.2 Deformation behavior of stretchable electronics circuit
  • 8.5.3 Equivalent stress analysis of a thermal sensor circuit design up to 10% strain
  • 8.5.4 Effect of width in reducing the equivalent stress in a thermal sensor circuit
  • 8.5.5 Equivalent stress limitation when the load is applied up to 10% strain
  • 8.6 Future recommendations
  • 8.7 Conclusion
  • Acknowledgments
  • References
  • 9 New methodology for qualification, prediction, and lifetime assessment of electronic systems
  • 9.1 Introduction
  • 9.2 Improved reliability assessment method
  • 9.2.1 Prediction handbooks.
  • 9.2.2 Life data analysis
  • 9.2.3 Accelerated life testing
  • 9.2.4 Improved reliability estimation methods
  • 9.2.5 Prediction handbooks: FIDES rather than MIL-217F
  • 9.2.6 Intelligent life data analysis rather than real life data averaging
  • 9.2.7 [HALT+ALT] rather than ALT
  • 9.2.8 Reliability block diagram tools and fault tree analysis for complex systems
  • 9.3 Application examples
  • 9.3.1 Electrolytic capacitors reliability analysis
  • 9.3.2 Demonstration of the combined methodology on front light module
  • 9.3.3 Supercapacitors reliability analysis
  • 9.3.3.1 Supercapacitors failure modes
  • 9.3.3.2 Design of an accelerated life test for supercapacitors
  • 9.3.3.2.1 Design of experiments
  • 9.3.3.2.2 Test setup
  • 9.3.3.3 Supercapacitors performance parameters and failure criteria
  • 9.3.3.4 Physics of failure models
  • 9.3.3.4.1 Degradation analysis based on data collected from research (expensive) setup
  • 9.3.3.4.2 Degradation analysis based on data collected from economical (cost-effective) setup
  • 9.3.3.4.3 Physics of failure modeling
  • 9.4 New trends to improve reliability analysis
  • 9.4.1 Mission profile
  • 9.4.2 Online condition monitoring-case study
  • 9.4.2.1 Concepts for connection defects detection, prognostics, and localization
  • 9.4.2.1.1 Method for connection defects detection and localization-based on online impedance measurements
  • 9.4.2.1.2 Method for connection defects detection-based on band-frequency filtering
  • 9.5 Summary
  • 9.6 General observations and conclusion
  • Acknowledgments
  • References
  • 2 Textiles industries
  • 10 Failure of yarns in different textile applications
  • 10.1 Introduction
  • 10.2 Staple yarn failure depending on the spinning method
  • 10.3 Yarn failure depending on the gauge length
  • 10.4 Yarn failure depending on the strain rate
  • 10.5 Modeling of the yarn failure.