http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Analysis of failures of embedded mechatronic systems
In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.
Front Cover; Embedded Mechatronic Systems; Copyright; Contents; Preface; Chapter 1: Highly Accelerated Testing; 1.1. Introduction; 1.2. Load Characteristics of the Super HAT Equipment; 1.3. Description of the Super HAT system; 1.4. Application; 1.5. Conclusion; 1.6. Bibliography; Chapter 2: Aging Power Transistors in Operational Conditions; 2.1. Introduction; 2.2. Aging Microwave Power Electronic Components Under Operational Conditions; 2.3. Application to the Study of Microwave Power Transistors; 2.4. Conclusion; 2.5. Bibliography; Chapter 3: Physical Defects Analysis of Mechatronic Systems.
3.1. Introduction3.2. Equipment and Methodology for Analyzing Failure in Mechatronic Systems; 3.3. Analysis of Physical Defects; 3.4. Conclusion; 3.5. Bibliography; Chapter 4: Impact of Voids in Interconnection Materials; 4.1. Introduction; 4.2. Thermal Transfer and Thermo-Elasticity; 4.3. Description of the Numerical Method; 4.4. Simulation of Thermal and Thermomechanical Effects in the Interconnection Material of an Electronic Module; 4.5. Conclusion; 4.6. Bibliography; Chapter 5: Electro-Thermo-Mechanical Modeling; 5.1. Introduction; 5.2. Theory of Electro-Thermo-Mechanical Coupling.
5.3. Simulation of Electro-Thermo-Mechanical Behavior Using the Finite Element Method5.4. Example of an Electro-Thermo-Mechanical Simulation of an HBT Transistor; 5.5. Modal Analysis of Mechanical Components; 5.6. Stochastic Modal Analysis of Structures; 5.7. Numerical Identification of the Elastic Parameters of Electronic Components; 5.8. Example of Modeling and Simulation of the Vibratory Behavior of Mechatronic Components; 5.9. Conclusion; 5.10. Lists of Abbreviations and Symbols; 5.11. Bibliography; Chapter 6: Meta-Model Development; 6.1. Introduction; 6.2. Definition of a Meta-Model.
6.3. Selection of Factors: Screening6.4. Creation of a Design of Experiment; 6.5. Modeling of the Response Surface: PLS Regression and Kriging; 6.6. Sensitivity Analysis of the Model: Variance Decomposition and Sobol Criterion; 6.7. Robust Design; 6.8. Conclusion; 6.9. Bibliography; Chapter 7: Optimizing Reliability of Electronic Systems; 7.1. Introduction; 7.2. Probabilistic and Multi-Physics Modeling; 7.3. Reliability-Based Optimization Methodology; 7.4. Reliability-Based Optimization of Material Layers of Heterojunction Bipolar Technology (HBT) Power Modules; 7.5. Conclusion.
7.6. BibliographyChapter 8: High-Efficiency Architecture for Power Amplifiers; 8.1. Introduction; 8.2. Main Reliability Parameters; 8.3. Methodology; 8.4. Aging Tests; 8.5. Other Results; 8.6. Origin of Degradations: Discussion; 8.7. Physical Analysis; 8.8. Amplifier Design Rules; 8.9. Conclusion; 8.10. Bibliography; List of Authors; Index; Summary of Volume 1.