rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Analysis of failures of embedded mechatronic systems
    part number: Volume 2
    part name: Modeling, simulation and optimization
  title info:
    title: Modeling, simulation and optimization
  name:
    name part: El Hami, Abdelkhalak
    role:
      role term: creator
    role:
      role term: author.
  name:
    name part: Pougnet, Philippe
    role:
      role term: author.
  name:
    name part: ScienceDirect (Online service)
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: ne
    date issued: 2015
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource
  abstract: In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.
  table of contents: Front Cover; Embedded Mechatronic Systems; Copyright; Contents; Preface; Chapter 1: Highly Accelerated Testing; 1.1. Introduction; 1.2. Load Characteristics of the Super HAT Equipment; 1.3. Description of the Super HAT system; 1.4. Application; 1.5. Conclusion; 1.6. Bibliography; Chapter 2: Aging Power Transistors in Operational Conditions; 2.1. Introduction; 2.2. Aging Microwave Power Electronic Components Under Operational Conditions; 2.3. Application to the Study of Microwave Power Transistors; 2.4. Conclusion; 2.5. Bibliography; Chapter 3: Physical Defects Analysis of Mechatronic Systems.
  table of contents: 3.1. Introduction3.2. Equipment and Methodology for Analyzing Failure in Mechatronic Systems; 3.3. Analysis of Physical Defects; 3.4. Conclusion; 3.5. Bibliography; Chapter 4: Impact of Voids in Interconnection Materials; 4.1. Introduction; 4.2. Thermal Transfer and Thermo-Elasticity; 4.3. Description of the Numerical Method; 4.4. Simulation of Thermal and Thermomechanical Effects in the Interconnection Material of an Electronic Module; 4.5. Conclusion; 4.6. Bibliography; Chapter 5: Electro-Thermo-Mechanical Modeling; 5.1. Introduction; 5.2. Theory of Electro-Thermo-Mechanical Coupling.
  table of contents: 5.3. Simulation of Electro-Thermo-Mechanical Behavior Using the Finite Element Method5.4. Example of an Electro-Thermo-Mechanical Simulation of an HBT Transistor; 5.5. Modal Analysis of Mechanical Components; 5.6. Stochastic Modal Analysis of Structures; 5.7. Numerical Identification of the Elastic Parameters of Electronic Components; 5.8. Example of Modeling and Simulation of the Vibratory Behavior of Mechatronic Components; 5.9. Conclusion; 5.10. Lists of Abbreviations and Symbols; 5.11. Bibliography; Chapter 6: Meta-Model Development; 6.1. Introduction; 6.2. Definition of a Meta-Model.
  table of contents: 6.3. Selection of Factors: Screening6.4. Creation of a Design of Experiment; 6.5. Modeling of the Response Surface: PLS Regression and Kriging; 6.6. Sensitivity Analysis of the Model: Variance Decomposition and Sobol Criterion; 6.7. Robust Design; 6.8. Conclusion; 6.9. Bibliography; Chapter 7: Optimizing Reliability of Electronic Systems; 7.1. Introduction; 7.2. Probabilistic and Multi-Physics Modeling; 7.3. Reliability-Based Optimization Methodology; 7.4. Reliability-Based Optimization of Material Layers of Heterojunction Bipolar Technology (HBT) Power Modules; 7.5. Conclusion.
  table of contents: 7.6. BibliographyChapter 8: High-Efficiency Architecture for Power Amplifiers; 8.1. Introduction; 8.2. Main Reliability Parameters; 8.3. Methodology; 8.4. Aging Tests; 8.5. Other Results; 8.6. Origin of Degradations: Discussion; 8.7. Physical Analysis; 8.8. Amplifier Design Rules; 8.9. Conclusion; 8.10. Bibliography; List of Authors; Index; Summary of Volume 1.
  note: Abdelkhalak El Hami, Philippe Pougnet.
  subject:
    topic: Mechatronics
  subject:
    topic: Reliability (Engineering)
  subject:
    topic: Mécatronique
  subject:
    topic: Fiabilité
  subject:
    topic: TECHNOLOGY & ENGINEERING
    topic: Mechanical
  subject:
    topic: Mechatronics
  subject:
    topic: Reliability (Engineering)
  classification: TJ163.12
  classification: 621.3
  identifier: 9780081004692
  identifier: 0081004699
  identifier: 9781785480140
  identifier: 1785480146
  identifier: 9780081004692 Ingram Content Group
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: NLE
    record creation date: 150525
    record change date: 20260407210823.6
    record identifier: in00005760032
    language of cataloging:
      language term: eng