rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Green and sustainable computing
    part number: Part II
  name:
    name part: Hurson, Ali.
  name:
    name part: ScienceDirect (Online service)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: ne
    place:
      place term: Amsterdam
    place:
      place term: Boston
    publisher: Elsevier/AP
    date issued: 2013
    edition: 1st ed.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (viii, 273 pages) : illustrations (some color).
  abstract: Since its first volume in 1960, Advances in Computers has presented detailed coverage of innovations in computer hardware, software, theory, design, and applications. It has also provided contributors with a medium in which they can explore their subjects in greater depth and breadth than journal articles usually allow. As a result, many articles have become standard references that continue to be of sugnificant, lasting value in this rapidly expanding field. In-depth surveys and tutorials on new computer technologyWell-known authors and researchers in the field<
  table of contents: Half Title; Title Page; Copyright; CONTENTS; PREFACE; Energy-Aware High Performance Computing-A Survey; 1 Introduction; 1.1 What is HPC?; 1.1.1 Who has the Fastest-The Top500 List; 1.1.2 Is One Number Really Enough?; 1.2 HPC Goes Green; 1.3 The Quest for the Right Metric; 1.3.1 Power vs. Energy; 1.3.2 Data Center Metrics; 1.3.3 Application-Level Metrics; 1.4 Outline of This Chapter; 2 Hardware Power Management; 2.1 State-of-the-Art; 2.1.1 CPUs; 2.1.2 Accelerators-GPUs; 2.1.3 Memory; 2.1.4 Network and Storage; 2.2 Outlook; 2.2.1 CPUs; 2.2.2 Memory; 2.2.3 Interconnects
  table of contents: 2.3 Energy-Aware Architectures2.3.1 Trends in x86 Clusters; 2.3.2 SoC-Based Systems; 2.3.3 IBM Blue Gene Family; 2.3.4 Application-Centric Architectures; 3 Software Aspects of Energy-Aware HPC; 3.1 Vendor-Specific Tools; 3.2 Scheduling; 3.3 Power Measurement and Modeling; 3.3.1 Power Measurement; 3.3.2 Power Consumption Modeling; 3.4 Tools to Optimize the Energy Consumption of HPC Applications; 3.4.1 Run-Time Systems; 3.5 Applications and Algorithms; 3.5.1 Communication Algorithms; 4 The eeClust Project; 4.1 Project Overview; 4.2 Application Analysis; 4.2.1 Automatic Energy Analysis
  table of contents: 4.3 Hardware Management4.4 Benchmarking; 5 Conclusion; List of Abbreviations; References; Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design; 1 Introduction; 2 Fundamental Characteristics of Fluids in Micro-Channels; 2.1 3D-IC Structure with Micro-Channel Cooling; 2.2 Conservation Law of Fluid Dynamics; 2.3 Dimensionless Numbers in Fluid Mechanics; 2.4 3D-IC with Micro-Channels: Modeling; 2.4.1 Energy Conservation; 2.4.2 Momentum Conservation; 2.5 Single and Two Phase Flow; 2.6 Laminar and Turbulent Flow; 2.7 Fanning Friction Factor
  table of contents: 3 Design Considerations of Micro-Channels in 3D-ICs3.1 Non-Uniform Power Profile; 3.2 TSV Constraint; 3.3 Thermal Stress; 4 3D-IC with Micro-Channels: Simplified Modeling; 4.1 Thermal Modeling; 4.1.1 Bulk Thermal Resistance; 4.1.2 RC Network; 4.1.3 Resistive Network; 4.2 Hydrodynamic Modeling; 4.2.1 Pressure Drop in Straight Micro-Channels; 4.2.2 Pressure Drop in Bended Micro-Channels; 4.3 Cooling Effectiveness with Respect to Micro-Channel Parameters; 4.3.1 Flow Rate; 4.3.2 Number of Micro-Channels; 4.3.3 Structure of Micro-Channels; 5 Micro-Channel Design Challenges
  table of contents: 5.1 Micro-Channel Modeling5.2 Micro-Channel Infrastructure Design; 5.2.1 Straight Micro-Channel Shape Optimization; 5.2.2 Complex Micro-Channel Infrastructures; 5.2.3 Hotspot-Optimized Micro-Channel Infrastructure; 6 Runtime Thermal Management Using Micro-Channels; 7 Conclusion; References; Sustainable DVFS-enabled Multi-Core Architectures with on-chip Wireless Links; 1 Introduction; 2 Related Work; 3 Proposed Architecture; 3.1 Physical Layer Design; 3.2 Wireless Link Placement; 3.3 Dynamic Voltage and Frequency Scaling; 4 Performance Evaluation; 4.1 Performance Metrics
  note: edited by Ali Hurson.
  note: Includes bibliographical references and indexes.
  note: English.
  subject:
    topic: Computers
    topic: Environmental aspects
  subject:
    topic: Sustainability
  subject:
    topic: Ordinateurs
    topic: Aspect de l'environnement
  subject:
    topic: Durabilité de l'environnement
  subject:
    topic: COMPUTERS
    topic: Computer Literacy
  subject:
    topic: COMPUTERS
    topic: Computer Science
  subject:
    topic: COMPUTERS
    topic: Data Processing
  subject:
    topic: COMPUTERS
    topic: Hardware
    topic: General
  subject:
    topic: COMPUTERS
    topic: Information Technology
  subject:
    topic: COMPUTERS
    topic: Machine Theory
  subject:
    topic: COMPUTERS
    topic: Reference
  subject:
    topic: Computers
    topic: Environmental aspects
  subject:
    topic: Sustainability
  classification: QA76.9.E58 G74 2013eb
  classification: 004
  related item:
    title info:
      title: Advances in computers. Volume eighty eight, Green and sustainable computing, pt. 2
  identifier: 9780124077256
  identifier: 0124077250
  identifier: 9780124078291
  identifier: 012407829X
  identifier: 1299318622
  identifier: 9781299318625
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: E7B
    record creation date: 130314
    record change date: 20260326194132.8
    record identifier: in00005751813
    language of cataloging:
      language term: eng