http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
1 online resource (viii, 273 pages) : illustrations (some color).
Since its first volume in 1960, Advances in Computers has presented detailed coverage of innovations in computer hardware, software, theory, design, and applications. It has also provided contributors with a medium in which they can explore their subjects in greater depth and breadth than journal articles usually allow. As a result, many articles have become standard references that continue to be of sugnificant, lasting value in this rapidly expanding field. In-depth surveys and tutorials on new computer technologyWell-known authors and researchers in the field<
Half Title; Title Page; Copyright; CONTENTS; PREFACE; Energy-Aware High Performance Computing-A Survey; 1 Introduction; 1.1 What is HPC?; 1.1.1 Who has the Fastest-The Top500 List; 1.1.2 Is One Number Really Enough?; 1.2 HPC Goes Green; 1.3 The Quest for the Right Metric; 1.3.1 Power vs. Energy; 1.3.2 Data Center Metrics; 1.3.3 Application-Level Metrics; 1.4 Outline of This Chapter; 2 Hardware Power Management; 2.1 State-of-the-Art; 2.1.1 CPUs; 2.1.2 Accelerators-GPUs; 2.1.3 Memory; 2.1.4 Network and Storage; 2.2 Outlook; 2.2.1 CPUs; 2.2.2 Memory; 2.2.3 Interconnects
2.3 Energy-Aware Architectures2.3.1 Trends in x86 Clusters; 2.3.2 SoC-Based Systems; 2.3.3 IBM Blue Gene Family; 2.3.4 Application-Centric Architectures; 3 Software Aspects of Energy-Aware HPC; 3.1 Vendor-Specific Tools; 3.2 Scheduling; 3.3 Power Measurement and Modeling; 3.3.1 Power Measurement; 3.3.2 Power Consumption Modeling; 3.4 Tools to Optimize the Energy Consumption of HPC Applications; 3.4.1 Run-Time Systems; 3.5 Applications and Algorithms; 3.5.1 Communication Algorithms; 4 The eeClust Project; 4.1 Project Overview; 4.2 Application Analysis; 4.2.1 Automatic Energy Analysis
4.3 Hardware Management4.4 Benchmarking; 5 Conclusion; List of Abbreviations; References; Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design; 1 Introduction; 2 Fundamental Characteristics of Fluids in Micro-Channels; 2.1 3D-IC Structure with Micro-Channel Cooling; 2.2 Conservation Law of Fluid Dynamics; 2.3 Dimensionless Numbers in Fluid Mechanics; 2.4 3D-IC with Micro-Channels: Modeling; 2.4.1 Energy Conservation; 2.4.2 Momentum Conservation; 2.5 Single and Two Phase Flow; 2.6 Laminar and Turbulent Flow; 2.7 Fanning Friction Factor
3 Design Considerations of Micro-Channels in 3D-ICs3.1 Non-Uniform Power Profile; 3.2 TSV Constraint; 3.3 Thermal Stress; 4 3D-IC with Micro-Channels: Simplified Modeling; 4.1 Thermal Modeling; 4.1.1 Bulk Thermal Resistance; 4.1.2 RC Network; 4.1.3 Resistive Network; 4.2 Hydrodynamic Modeling; 4.2.1 Pressure Drop in Straight Micro-Channels; 4.2.2 Pressure Drop in Bended Micro-Channels; 4.3 Cooling Effectiveness with Respect to Micro-Channel Parameters; 4.3.1 Flow Rate; 4.3.2 Number of Micro-Channels; 4.3.3 Structure of Micro-Channels; 5 Micro-Channel Design Challenges
5.1 Micro-Channel Modeling5.2 Micro-Channel Infrastructure Design; 5.2.1 Straight Micro-Channel Shape Optimization; 5.2.2 Complex Micro-Channel Infrastructures; 5.2.3 Hotspot-Optimized Micro-Channel Infrastructure; 6 Runtime Thermal Management Using Micro-Channels; 7 Conclusion; References; Sustainable DVFS-enabled Multi-Core Architectures with on-chip Wireless Links; 1 Introduction; 2 Related Work; 3 Proposed Architecture; 3.1 Physical Layer Design; 3.2 Wireless Link Placement; 3.3 Dynamic Voltage and Frequency Scaling; 4 Performance Evaluation; 4.1 Performance Metrics
Includes bibliographical references and indexes.
Advances in computers. Volume eighty eight, Green and sustainable computing, pt. 2