rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Electromigration in thin films and electronic devices
    sub title: materials and reliability
  name:
    name part: Kim, Choong-Un.
  name:
    name part: ScienceDirect (Online service)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: enk
    place:
      place term: Oxford
    publisher: Woodhead Pub.
    date issued: 2011
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xii, 329 pages) : illustrations.
  abstract: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints. With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuitsComprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigrationDeals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure.
  table of contents: Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
  note: edited by Choong-Un Kim.
  note: Includes bibliographical references and index.
  subject:
    topic: Thin films
  subject:
    topic: Couches minces
  subject:
    topic: TECHNOLOGY & ENGINEERING
    topic: Mechanical
  subject:
    topic: Thin films
  classification: TA418.9.T45 E54 2010eb
  classification: 621.38152
  related item:
    title info:
      title: Electromigration in thin films and electronic devices
    origin info:
      publisher: Oxford ; Philadelphia : Woodhead Publishing, ©2011
    identifier: (DLC) 2011934923
    identifier: (OCoLC)713610407
  related item:
    title info:
      title: Woodhead Publishing in materials
  identifier: 0857093754
  identifier: 9780857093752
  identifier: 1845699378
  identifier: 9781845699376
  identifier: 1613443919
  identifier: 9781613443910
  identifier: 2011934923
  identifier: CL0500000431 Safari Books Online
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: HS0
    record creation date: 110926
    record change date: 20260326190428.5
    record identifier: in00005748668
    language of cataloging:
      language term: eng