Cover Image

Hybrid microcircuit technology handbook : materials, processes, design, testing and production /

Show other versions (2)

Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...

Full description

Bibliographic Details
Main Author: Licari, James J., 1930-
Corporate Author: ScienceDirect (Online service)
Other Authors: Enlow, Leonard R.
Format: eBook
Language:English
Language Notes:English.
Published: Westwood, N.J. : Noyes Publicatons, ©1998.
Edition:2nd ed.
Series:Materials science and process technology series.
Subjects:
Hybrid integrated circuits > Design and construction > Handbooks, manuals, etc.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Integrated.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
Hybrid integrated circuits > Design and construction
Hybridschaltung
INTEGRATED CIRCUITS.
HYBRID CIRCUITS.
MICROELECTRONICS.
ELECTRONIC PACKAGING.
THICK FILMS.
THIN FILMS.
MICROMINIATURIZED ELECTRONIC DEVICES.
DESIGN ANALYSIS.
FAILURE ANALYSIS.
MANUFACTURING.
HANDBOOKS.
Electronic books.
Handbook
handbooks.
Handbooks and manuals
Handbooks and manuals.
Guides et manuels.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Introduction
  • Substrates
  • Thin Film Processes
  • Thick Film Processes
  • Resistor Trimming
  • Parts Selection
  • Assembly Processes
  • Testing
  • Handling and Clean Rooms
  • Design Guidelines
  • Documentation and Specifications
  • Failure Analysis
  • Multichip Modules: A New Breed of Hybrid Microcircuits
  • References
  • Index.