Handbook of polymers for electronics /
"Polymers used in electronics and electrical engineering are essential for the development of high-tech products, including applications in space, aviation, health, automotive, communication, energy harvesting, energy storage, light-emitting and sensing, flexible electronics, robotic systems, a...
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| Format: | eBook |
| Language: | English |
| Published: |
Toronto :
ChemTec Publishing,
2026.
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| Edition: | 2nd edition. |
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| Online Access: | Connect to the full text of this electronic book |
| Summary: | "Polymers used in electronics and electrical engineering are essential for the development of high-tech products, including applications in space, aviation, health, automotive, communication, energy harvesting, energy storage, light-emitting and sensing, flexible electronics, robotic systems, analytical sensors, consumer products, and many others. Conductivity is the first feature that comes to mind with these polymers, but they are currently much more complex, having shape-memory, piezoelectric, ferroelectric, and many other properties. Some polymers used in electronics are modifications of commodity or engineering polymers, using many specially developed additives. Typical features of mainstream polymers, such as mechanical performance, optical behavior, and environmental stability, are required by polymers used in electronics, but frequently they must be enhanced to perform in these demanding applications. In many applications, the properties of typical polymers (usually included in popular handbooks) are not sufficient, creating the need to develop special grades or simply use completely new chemistry for their synthesis. Similarly, the typical set of properties included in the description of the mainstream polymer is not sufficient for polymer selection for these applications as they require different data. The data included in the Handbook of Polymers for Electronics come from open literature (published articles, conference papers, and books), literature available from manufacturers of various grades of polymers, plastics, and finished products, and patent literature. The above sources were searched, including the most recent literature. This underscores one of the primary goals of this undertaking: to provide readers with the most up-to-date information, which will be frequently updated in the future. The presentation of data for all polymers is based on a consistent pattern of data arrangement, although, depending on data availability, only data fields that contain actual values are included for each polymer. The entire scope of the data is divided into sections to make data comparison and search easy. The data are organized into the following sections: • General (Common name, IUPAC name, ACS name, Acronym, CAS number, EC number, RTECS number, Linear formula) • History (Person to discover, Date, Details) • Synthesis (Monomer(s) structure, Monomer(s) CAS number(s), Monomer(s) molecular weight(s), Monomer(s) expected purity(ies), Monomer ratio, Degree of substitution, Formulation example, Method of synthesis, Temperature of polymerization, Time of polymerization, Pressure of polymerization, Catalyst, Yield, Activation energy of polymerization, Free enthalpy of formation, Heat of polymerization, Initiation rate constant, Propagation rate constant, Termination rate constant, Chain transfer rate constant, Inhibition rate constant, Polymerization rate constant, Method of polymer separation, Typical impurities, Typical concentration of residual monomer, Number average molecular weight, Mn, Mass average molecular weight, Mw, Polydispersity, Mw/Mn, Polymerization degree, Molar volume at 298K, Molar volume at melting point, Van der Waals volume, Radius of gyration, End-to-end distance of unperturbed polymer chain, Degree of branching, Type of branching, Chain-end groups, Doping, Conjugation, Ionic conductivity) • Structure (Crystallinity, Crystalline structure, Cell type (lattice), Cell dimensions, Unit cell angles, Number of chains per unit cell, Crystallite size, Spacing between crystallites, Polymorphs, Tacticity, Cis content, Chain conformation, Entanglement molecular weight, Lamellae thickness, Heat of crystallization, Rapid crystallization temperature, Avrami constants, k/n) • Commercial polymers (Selected manufacturers, Trade names, Composition information) • Physical properties (Density, Bulk density, Color, Refractive index, Birefringence, Molar polarizability, Transmittance, Haze, Gloss, Odor, Melting temperature, Softening point, Decomposition temperature, Fusion temperature, Thermal expansion coefficient, Thermal conductivity, Glass transition temperature, Specific heat capacity, Heat of fusion, Calorific value, Maximum service temperature, Long term service temperature, Temperature index (50% tensile strength loss after 20,000 h/5000 h), Heat deflection temperature at 0.45 MPa, Heat deflection temperature at 1.8 MPa, Vicat temperature VST/A/50, Vicat temperature VST/B/50, Start of thermal degradation, Enthalpy, Acceptor number, Donor number, Hansen solubility parameters, dD, dP, dH, Molar volume, Hildebrand solubility parameter, Surface tension, Power factor, Coefficient of friction, Permeability to nitrogen, Permeability to oxygen, Permeability to water vapor, Diffusion coefficient of nitrogen, Diffusion coefficient of oxygen, Diffusion coefficient of water vapor, Contact angle of water, Surface free energy, Speed of sound, Acoustic impedance, Attenuation) • Electrical properties (Conductivity, Current density, Optoelectrical properties, Dielectric loss factor, Relative permittivity, Dissipation factor, Volume resistivity, Surface resistivity, Dielectric strength, Comparative tracking index, CTI, test liquid A, Comparative tracking index, CTIM, test liquid B, Arc resistance, Loss tangent, Anisotropy of electrical properties, Impedance, Shielding effect, Ferroelectric properties, Piezoelectric properties, Charge carrier mobility, Bandgap, Actuation signal, Actuation bandwidth, Solderability) • Mechanical properties (Tensile strength, Tensile modulus, Tensile stress at yield, Tensile creep modulus, 1000 h, elongation 0.5 max, Elongation, Tensile yield strain, Flexural strength, Flexural modulus, Elastic modulus, Compressive strength, Young's modulus, Tear strength, Charpy impact strength, Charpy impact strength, notched, Izod impact strength, Izod impact strength, notched, Shear strength, Tenacity, Abrasion resistance, Adhesive bond strength, Poisson's ratio, Compression set, Shore A hardness, Shore D hardness, Rockwell hardness, Ball indention hardness at 358 N/30 S, Shrinkage, Brittleness temperature, Viscosity number, Intrinsic viscosity, Mooney viscosity, Melt viscosity, shear rate=1000 s-1, Melt volume flow rate, Melt index, Water absorption, Moisture absorption) • Chemical resistance (Acid dilute/concentrated, Alcohols, Alkalis, Aliphatic hydrocarbons, Aromatic hydrocarbons, Esters, Greases & oils, Halogenated hydrocarbons, Ketones, Theta solvent, Good solvent, Non-solvent) • Flammability (Flammability according to UL-standard; thickness 1.6/0.8 mm, Ignition temperature, Autoignition temperature, Limiting oxygen index, Heat release, NBS smoke chamber, Burning rate (Flame spread rate), Char, Heat of combustion, Volatile products of combustion) • Weather stability (Spectral sensitivity, Activation wavelengths, Excitation wavelengths, Emission wavelengths, Activation energy of photooxidation, Depth of UV penetration, Important initiators and accelerators, Products of degradation, Stabilizers) • Thermal stability (Activation energy of thermal degradation, Decomposition rate, Important initiators and accelerators, Products of degradation, Stabilizers)"-- |
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| Physical Description: | 1 online resource. Issued also in print format. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781774670873 1774670879 |