http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
VLSI interconnect technology with artificial plasmonics
bridging the gap between electronics and optics
"This highlights the urgent need to examine the physics of power dissipation and innovate device materials to significantly cut energy consumption and ensure a sustainable computing future. A significant portion of this power consumption and heat generation comes from servers of datacenters, which include processors, memory, and interconnects. About 20% of a server's power usage is due to interconnects and switches. High-density interconnects in packagelevel integrations are especially power-intensive due to high parasitics, causing excessive power loss, signal delay, distortion, and crosstalk."-- Provided by publisher.
Includes bibliographical references and index.