VLSI interconnect technology with artificial plasmonics : bridging the gap between electronics and optics /
"This highlights the urgent need to examine the physics of power dissipation and innovate device materials to significantly cut energy consumption and ensure a sustainable computing future. A significant portion of this power consumption and heat generation comes from servers of datacenters, wh...
| Main Authors: | , |
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| Format: | eBook |
| Language: | English |
| Published: |
Hoboken, New Jersey :
John Wiley & Sons Inc,
[2026]
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| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
| Summary: | "This highlights the urgent need to examine the physics of power dissipation and innovate device materials to significantly cut energy consumption and ensure a sustainable computing future. A significant portion of this power consumption and heat generation comes from servers of datacenters, which include processors, memory, and interconnects. About 20% of a server's power usage is due to interconnects and switches. High-density interconnects in packagelevel integrations are especially power-intensive due to high parasitics, causing excessive power loss, signal delay, distortion, and crosstalk."-- Provided by publisher. |
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| Physical Description: | 1 online resource |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781394290000 1394290004 9781394289981 1394289987 9781394289967 1394289960 |