rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Thermal conductivity 33
    sub title: thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA
  name:
    name part: International Thermal Conductivity Conference 2017 : Logan, Utah)
    role:
      role term: creator
  name:
    name part: Ban, Heng
    role:
      role term: editor.
  name:
    name part: Knovel (Firm)
  name:
    name part: International Thermal Expansion Symposium 2017 : Logan, Utah)
  type of resource: text
  genre: bibliography
  genre: conference publication
  genre: Electronic books.
  genre: Conference papers and proceedings.
  origin info:
    place:
      place term: pau
    date issued: 2018
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xi, 265 pages)
  note: Heng Ban [editor].
  note: Includes bibliographical references and author index.
  subject:
    topic: Heat
    topic: Conduction
    genre: Congresses
  subject:
    topic: Heat
    topic: Conduction
    topic: Measurement
    topic: Methodology
    genre: Congresses
  subject:
    topic: Materials
    topic: Thermal properties
    genre: Congresses
  subject:
    topic: Materials
    topic: Thermal properties
    topic: Measurement
    topic: Methodology
    genre: Congresses
  subject:
    topic: Expansion (Heat)
    genre: Congresses
  subject:
    topic: Expansion (Heat)
    topic: Measurement
    topic: Methodology
    genre: Congresses
  subject:
    topic: Chaleur
    topic: Conduction
    genre: Congrès
  subject:
    topic: Matériaux
    topic: Propriétés thermiques
    genre: Congrès
  subject:
    topic: Dilatation (Thermodynamique)
    genre: Congrès
  subject:
    topic: Expansion (Heat)
  subject:
    topic: Heat
    topic: Conduction
  subject:
    topic: Materials
    topic: Thermal properties
  classification: QC320.8 .I58 2017
  classification: 536.2012
  related item:
    title info:
      title: Thermal conductivity 33
    name:
      name part: International Thermal Conductivity Conference (33rd : 2017 : Logan, Utah).
    origin info:
      publisher: Lancaster, PA : DEStech Publications, [2018]
    identifier: (OCoLC)1155062268
  identifier: 9781523153800
  identifier: 1523153806
  identifier: 9781605955353
  identifier: 1605955353
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: HUA
    record creation date: 230804
    record change date: 20260209220150.7
    record identifier: in00005684711
    language of cataloging:
      language term: eng