http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Handbook of semiconductor interconnection technology
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the ""likely directions"" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available,
Preface; The Editors; Contributors; Contents; CHAPTER 1 Methods/Principles of Deposition and Etching of Thin Films; CHAPTER 2 Characterization; CHAPTER 3 Semiconductor Contact Technology; CHAPTER 4 Interlevel Dielectrics; CHAPTER 5 Metallization; CHAPTER 6 Chip Integration; CHAPTER 7 Reliability; Index
edited by Geraldine C. Schwartz, Kris V. Srikrishnan.
Description based upon print version of record.
Includes bibliographical references and index.
Interconnects (Integrated circuit technology)
Interconnexions (Technologie des circuits intégrés)