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Tribology in chemical-mechanical planarization /

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The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed...

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Bibliographic Details
Main Author: Liang, Hong, 1961 (Author)
Corporate Author: Taylor & Francis
Other Authors: Craven, David R., 1945-
Format: eBook
Language:English
Language Notes:English.
Published: Boca Raton, Fla. : Taylor & Francis, 2005.
Subjects:
Tribology.
Grinding and polishing.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Front Cover; Preface; About the Authors; Contents; Chapter 1: Introduction; Chapter 2: Surface properties; Chapter 3: Friction; Chapter 4: Lubrication; Chapter 5: Wear in CMP; Chapter 6: Force transmission; Chapter 7: CMP pads; Chapter 8: Post-CMP cleaning; Index