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Tribology in chemical-mechanical planarization /

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The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed...

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Bibliographic Details
Main Author:	Liang, Hong, 1961 (Author)
Corporate Author:	Taylor & Francis
Other Authors:	Craven, David R., 1945-
Format:	eBook
Language:	English
Language Notes:	English.
Published:	Boca Raton, Fla. : Taylor & Francis, 2005.
Subjects:	Tribology. Grinding and polishing. Electronic books.
Online Access:	Connect to the full text of this electronic book

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